| 发明名称 |
Method of fabricating an electronic circuit moulded in two or three dimensions |
| 摘要 |
The method is designed to obtain moulded circuits obtained by stamping on a part 2 by direct pressure of an etched die 1 or by pressure of a material overmoulded at 4. Application to the fabrication of electronic circuits. <IMAGE>
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| 申请公布号 |
FR2674724(A1) |
申请公布日期 |
1992.10.02 |
| 申请号 |
FR19910003929 |
申请日期 |
1991.03.27 |
| 申请人 |
LECOENT FERNAND |
发明人 |
LE COENT FERNAND |
| 分类号 |
H05K3/00;H05K3/04;H05K3/10 |
主分类号 |
H05K3/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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