Preflux coating composition for copper

摘要

A preflux composition suitable for use as a preflux for protecting the solderability of copper during a heating cycle comprising rosin, antioxidant, and a solvent system comprised of glycol ether and terpene, process for protecting the solderability of copper which is to be subjected to a heating cycle prior to soldering comprising using said preflux composition, and articles comprising printed circuits or wiring boards which have copper areas coated with said preflux composition.