| 摘要 |
PURPOSE:To reduce a cost by forming a prescribed pattern in an organic resist layer, forming a metal layer for which this pattern is transferred, forming a glass layer with the metal layer as a die and embedding a coil in the glass layer. CONSTITUTION:As the resist layer, a PMMA layer 23 is formed on the substrate 21 of Cu and with this layer as a mask, the device is formed by exposing and developing the layer 23. In this case, the base layer of an Ni layer 22 is previously piled on the substrate 21. Next, glass mold is performed with the pattern as the die, and a glass layer 27 is formed in the state of passing a gate 26 between a plate 25 composed of an insulator and a die 24 of Ni. Then, the layer 22 is separated from the substrate 21 and afterwards, a Cu layer 3 to be the coil is formed. In such a case, an electrode layer is first formed by non-electrolytic plating and afterwards, electrolytic plating is performed. Thus, a coil 3 can be embedded in the insulated layer 27 of glass. Next, the lower face is mechanically ground and made flat so as to eliminate the coarseness of the Cu surface and the step of glass. |
