| 摘要 |
PURPOSE:To improve wettability and to supply a stable film thickness by transferring an adhesive layer or a paste layer formed on a film to a lead frame, and fixing a semiconductor chip by the adhesive layer or the paste layer. CONSTITUTION:A gap 8 through which a synthetic resin film 7 is passed is provided in a vessel 6 in which an adhesive or paste is charged, and a layer 4 of predetermined thickness is transferred to the passed film 7. After the film 7 coated with the layer 4 is conveyed to a lead frame 3, a collet 14 is pressed by a suitable load to transfer the layer 4 to a bed on the frame 3. A predetermined semiconductor chip 5 is fixed to the transferred layer 4. Thus, excellent wettability fitted with the chip can be obtained in a predetermined film thickness. Further, various types of components to be fixed can be handled by designing the shape of the collet.
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