SEMICONDUCTOR PAG ASSEMBLY FOR TAP TAPE

摘要

The TAB tape used in the tape automated bonding (TAB) technology has the improved strength not to break easily by mechanical force. This tape consists of tape guiders arranging sprocket holes to convey the tape, an insulation base film to attach a chip, and a thin metal layer covered up to the area of the tape guiders including adhesive layer and effective pad area. The tape provides the reduction of tape deformation and TAB failure to improve the reliability of the device.