发明名称 Method of forming thick film pattern and material for forming thick film pattern
摘要 PCT No. PCT/JP91/00080 Sec. 371 Date Sep. 19, 1991 Sec. 102(e) Date Sep. 19, 1991 PCT Filed Jan. 25, 1991 PCT Pub. No. WO91/11307 PCT Pub. Date Aug. 8, 1991A female mold (2, 12, 22, 32, 42, 52, 62) having a desirable pattern is formed on a substrate (1, 11, 21, 31, 41, 51, 61). Next, ceramic material (3, 13, 23, 33, 43, 53, 63) is filled in spaces in the female mold. Thereafter, the female mold is removed by heating the entire substrate, whereby a desirable thick film pattern can be finely and easily formed. The inorganic paste material comprising inorganic liquid vehicle containing water glass as main ingredient and powdery solid dispersed in the inorganic liquid vehicle is used as the ceramic material. The volume change of the inorganic paste material is small during the drying and calcinating processes, thus the inorganic paste material is prevented from being broken.
申请公布号 US5580511(A) 申请公布日期 1996.12.03
申请号 US19910762008 申请日期 1991.09.19
申请人 DAI NIPPON INSATSU KABUSHIKI KAISHA 发明人 SAKAI, YORIHIKO;ONO, NORIKATSU;MINEO, NORIKAZU;MATSUMOTO, TAKESHI;FUJII, HIDEAKI
分类号 G03F7/00;H01L21/48;H01L21/70;H05K1/03;H05K1/09;H05K3/00;H05K3/12;(IPC1-7):C04B37/00 主分类号 G03F7/00
代理机构 代理人
主权项
地址