| 摘要 |
<p>PURPOSE:To improve heat radiation characteristic by dividing a metal frame, directly placing a plurality of high power elements on the frames, and exposing the frame with the exterior of molding resin. CONSTITUTION:A metal frame 1 in which a P0 element 7 is directly die bonded and a metal frame 1' for placing a circuit board 5 for placing various semiconductor components are provided. In order to improve heat radiation characteristic of the element 7, the frame 1 in which the element 7 is die bonded is exposed from sheath resin 3 and used also as a heat radiation plate. That is, the frame is divided to directly die bond the elements to the frames to be able to place the plurality of elements and the frame in which the elements are directly die bonded is exposed with the exterior of the resin. Accordingly, its heat radiation characteristic is improved.</p> |
