发明名称 LEAD FRAME FOR HOLLOW PLASTIC PACKAGE
摘要 PROBLEM TO BE SOLVED: To obtain a hollow plastic package where a case and a lead are prevented from separating. SOLUTION: The lead bending parts 201 of a source lead 202a, a gate lead 202b, and a drain lead 202c used for bending them for forming are made narrower than the other parts of the leads 202a, 202b, and 202c, whereby the leads 202a, 202b, and 202c can be lessened in resisting force when they are bent, stress imposed on a plastic case 204 and the leads 202a, 202b, and 202c when the leads are bent is reduced, and the case 204 and the leads 202a, 202b, and 202c are prevented from being separated off.
申请公布号 JPH09213855(A) 申请公布日期 1997.08.15
申请号 JP19960013878 申请日期 1996.01.30
申请人 NEC CORP 发明人 TANAKA JUNICHI
分类号 H01L23/48;H01L23/047;H01L23/495 主分类号 H01L23/48
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