| 摘要 |
<p>PROBLEM TO BE SOLVED: To bond an IC chip onto a die pad without using any adhesive by setting the IC chip in a rectangular opening made in a die pad part and holding the IC chip in the opening with resiliency at the peripheral part of the opening. SOLUTION: A die pad 3 is provided with a rectangular central opening 5 having dimensions smaller than the external dimensions of an IC chip 4. When the IC chip 4 is fixed to a lead frame 1, the opening 5 is deformed resiliently outward and enlarged at first. After being enlarged sufficiently, the opening 5 is inserted with the IC chip 4. When the enlarging force is removed, inner surface 6 of the opening 5 is press fitted resiliently to the outer surface of the IC chip 4 which is thereby secured in the opening 5 by the resiliency of the lead frame material. According to the method, the bonding work is simplified and the working environment can be improved because no adhesive is employed.</p> |
