Integrated circuit comprising conductive lines with negative profile and related method of fabrication

摘要

A semiconductor integrated circuit comprising lines of conductive material (4) for the electrical interconnection between parts of the circuit, and a layer of dielectric material (6), superimposed to the lines of conductive material (4). The lines of conductive material (4) have a vertical profile such that the smallest distance between two adjacent lines of conductive material is located at their upper surfaces.