POLISHING PAD USED FOR CHEMICAL AND MECHANICAL POLISHING OF SEMICONDUCTOR SUBSTRATE

摘要

PURPOSE: A polishing pad is provided to uniformly polish an entire semiconductor substrate through a control a polishing amount by establishing an area formed with holes or grooves in different conditions on a polishing face. CONSTITUTION: A polishing face polishes a surface of a semiconductor substrate to leave slurry. A first polishing face area(103) has a plurality of first parts containing the slurry with a first volume ratio with respect to a unit area of the polishing face and the plurality of first parts are formed in a first depth, a first width, and a first mutual distance(157) on the polishing face. A second polishing face area(105) has a plurality of second parts containing the slurry with a second volume ratio with respect to a unit area of the polishing area different from the first volume ratio and the second parts are formed in a second depth, a second width, and a second mutual distance(127).