| 摘要 |
PURPOSE:To elongate the intrusion path of moisture, basic ion, etc., passing through the gap formed on the peripheral surface of a heat spreader coated with a mold resin. CONSTITUTION:An IC chip is bonded to one side of a heat spreader 2 in a package and a lead frame 14 is also bonded while keeping insulation and the IC chip is wire bonded to the lead frame 14. It is then subjected entirely to transfer molding of mold resin 7 while exposing the other surface 2a of the heat spreader 2. A step 2c is formed on the peripheral surface 2b of the heat spreader 2 covered with the mold resin 7. Since the contact area is increased on the peripheral surface 2b, the intrusion path of moisture, basic ion, etc., up to the internal semiconductor element is elongated even if a gap is formed on the peripheral surface 2a. |
