| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for forming bumps on a semiconductor wafer whereby the productivity of the semiconductor wafer when forming the bumps is improved in comparison with a conventional case. SOLUTION: In the method and the apparatus, a bump forming head 190, a recognizing apparatus 150, and a controller 180 are provided. Further, ICs formed on a semiconductor wafer are so divided into basic blocks 230 as to perform continuously the formations of bumps to the ICs included in one basic block and perform the positional recognition of one of the remaining basic blocks only when sifting the bump forming operation from the one basic block to one of the remaining basic blocks. AS a result, the times of the positional recognitions can be cut down largely and the productivity of the semiconductor wafer can be improved, in comparison with the conventional case wherein the operation of the positional recognition of each IC is performed whenever forming bumps in each IC. |
