| 摘要 |
PROBLEM TO BE SOLVED: To provide a hybrid integrated circuit device of smaller body size by supporting a plurality of substrates on different planes. SOLUTION: Circuit boards 11 and 12 are contained in a casing 13 while being supported in parallel with each other. Since the circuit boards 11 and 12 are disposed three-dimensionally, they can be mounted in an area required for mounting only the circuit board 11 and mountable area of the circuit board per unit area can be increased. Consequently, the size of a hybrid integrated circuit device 1 required for mounting a circuit board of a fixed area can be reduced. The circuit boards 11 and 12 are disposed such that the mounted electronic components 60 face each other and thereby the body size of the circuit board in the height direction can also be reduced. |
