| 摘要 |
<p>The method involves engaging pins in a line of perforations (11) arranged at a base (1) of a package. A thermoplastic material film is thermoformed for enveloping the line of pins with a continuous voile. The pins are removed so that the voile which has been allowed to be solidified forms a projecting part or a section within the package. The perforations have cuts defining angular sectors (12) which are lifted by the pins when the pins are engaged in the package, and oppose a retraction of the film while allowing a free passage for an ambient air, during the removal of the film. Independent claims are also included for the following: (1) a package in a semi-rigid material formed by implementing a plate or tray type package manufacturing method (2) a blank, precut or scored, formed of a semi-rigid material for forming a rough-shape of a plate or tray type package.</p> |
