发明名称 THERMOCONDUCTIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a thermoconductive resin composition that gives a molded product exhibiting good mechanical strength and thermoconductivity. SOLUTION: The thermoconductive resin composition comprises (A) a polypropylene resin, a polyamide resin or a thermoplastic resin mixture containing at least 50 mass% thereof, (B) a thermoplastic elastomer and (C) a thermoconductive filler, and gives a molded article having a flexural modulus of at most 5,000 MPa and a thermoconductivity of at least 2 W/m K. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008094924(A) 申请公布日期 2008.04.24
申请号 JP20060277080 申请日期 2006.10.11
申请人 DAICEL POLYMER LTD 发明人 WAKITA NAOKI
分类号 C08L23/10;C08K3/00;C08L21/00;C08L77/00 主分类号 C08L23/10
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