| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface treatment agent usable when soldering is performed using lead-free solder as well as the conventional eutectic solder, and capable of forming a film having excellent heat resistance. SOLUTION: Disclosed is a surface treatment agent for treating the surface of a base material composed of copper or the alloy thereof. The agent is composed of a solution of an imidazole compound and sugar alcohol and contains zinc ions. COPYRIGHT: (C)2009,JPO&INPIT
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