| 摘要 |
PURPOSE: An angle adjusting type tilting structure of sputtering device is provided to shorten the sputtering time by sputtering one wafer with more than two ion guns at the same time. CONSTITUTION: A tilting apparatus(20) adjusts the angle and performs the sputtering at the same time. An integrated shutter(10) moves with the ion gun according to the tilting angle in tilting. The decoupling-type shuts off the mutual influence when the different target is used respectively. A heating table(30) is mounted to have the predetermined distance apart from the metal source target.
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