SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To suppress irregularity of an under surface of a wafer.SOLUTION: A semiconductor device manufacturing method includes: a process of forming a stopper 20 on a top face 11 of a wafer 10; a process of forming a protection material 30 on the top face of the wafer so as to cover bump electrodes 18 and the stopper formed on the top face of the wafer; a process of planarizing a top face of the protection material in a manner such that planarization is stopped by the stopper; and a process of grinding an under surface of the wafer with reference to the planarized top face of the protection material.SELECTED DRAWING: Figure 2