| 摘要 |
The purpose of the present invention is to provide a wafer processing tape, reducing label marks and reducing inflow of air to a space between an adhesive layer and a release film. The wafer processing tape comprises: the long release film (11); the adhesive layer (12) having a predetermined flat surface shape and installed on a first surface of the release film (11); an adhesive film (13) covering the adhesive layer (12), having a label unit (13a) which has the predetermined flat surface shape and is installed to come in contact with the release film (11) around the adhesive layer (12), and having a peripheral unit (13b) surrounding the outside of the label unit (13a); and a support unit (14) formed on a second surface opposite to the first surface of the release film (11) and installed in both short end parts of the release film (11). The support member (14) has a thickness which is equal to or more than 0.3 times of the thickness of the adhesive layer (12) and less than 1.0 times the thickness of the adhesive layer (12). |
