发明名称 |
Glass based multichip package |
摘要 |
In implementations, a glass-based multichip package includes a photodefinable glass-based substrate, at least one electronic component disposed on the photodefinable glass-based substrate, and a portion of the photodefinable glass-based substrate that has been exposed to ultraviolet light, where the portion of the photodefinable glass-based substrate includes ceramic. Additionally, the sensor package may include additional electronic components, a glass touch panel, and/or a printed circuit board. In implementations, fabricating the sensor package device includes receiving a photodefinable glass-based substrate, etching the photodefinable glass-based substrate, and forming a ceramic portion of the photodefinable glass-based substrate. |
申请公布号 |
US9371982(B2) |
申请公布日期 |
2016.06.21 |
申请号 |
US201314136556 |
申请日期 |
2013.12.20 |
申请人 |
Maxim Integrated Products, Inc. |
发明人 |
Zhou Tiao |
分类号 |
H01L29/22;F21V21/00;B32B17/00;H01L21/48;H01L31/0203;H01L23/13;H01L23/15;H01L23/538;H01L25/16;H01L23/498;H01L23/00;H01L27/146 |
主分类号 |
H01L29/22 |
代理机构 |
Advent, LLP |
代理人 |
Advent, LLP |
主权项 |
1. A glass-based multichip package, comprising:
a photodefinable glass-based substrate, where a portion of the photodefinable glass-based substrate includes a light isolation component that is converted to ceramic; at least one electronic component directly disposed on the photodefinable glass-based substrate; at least one interconnect including a solder ball directly coupled to the photodefinable glass-based substrate and a printed circuit board, and wherein the electronic component comprises a sensor, the sensor including a light sensor coupled to the photodefinable glass-based substrate and coupled proximate to a lens formed in the photodefinable glass-based substrate, and where light passes through the lens to the light sensor. |
地址 |
San Jose CA US |