| 摘要 |
An image pickup device 1 includes a light-receiving device unit 2, a processing portion 3, a first connection body 4, and a second connection body 5. The first connection body 4 electrically connects a first electrode 11 of the light-receiving device unit 2 to a corresponding second electrode 21 of the processing portion 3. The first connection body 4 includes an indium-containing solder portion 29 disposed between the first electrode 11 and the second electrode 21, and a barrier layer 30 for suppressing alloying of the solder portion 29 with the first electrode 11 and the second electrode 21. The second connection body 5 includes an alloy portion 33 formed by alloying with a solder containing a material having a melting point equal to or higher than a melting point of the first connection body and a hardness higher than that of the first connection body. |
