| 摘要 |
This solder alloy contains Al and/or Al 2 O 3 in the amount of 0.006-0.15 wt% in an Sn-Cu hypereutectic area. In addition, this solder alloy comprises Cu in the amount of 0.7-7.6 wt%, and Al and/or Al 2 O 3 in the amount of 0.006-0.5 wt%, with the remainder being Sn. Preferably, the amount of Cu contained is 2.0 wt% or greater. This solder alloy also has Ni substituted for Sn in the amount of 0.03-0.1 wt% of the composition thereof. Furthermore, this solder alloy has Ag substituted for Sn in the amount of 0.1-3.5 wt% of the composition thereof. |
