HIGH-FREQUENCY SEMICONDUCTOR MODULE

摘要

PROBLEM TO BE SOLVED: To provide a high-frequency semiconductor module capable of enhancing its performance.SOLUTION: A high-frequency semiconductor module according to an embodiment comprises: a cooling body; a high-frequency semiconductor device that has on its surface a high-frequency circuit including a signal processing circuit arranged on the cooling body and configured to perform signal processing to a high-frequency signal; a thermal insulation container that accommodates the cooling body and the high-frequency semiconductor device therein; and a plurality of shielding bodies provided between the high-frequency semiconductor device including the high-frequency circuit and an inner surface of the thermal insulation container. The plurality of shielding bodies electromagnetically-spatially separate a space on the high-frequency circuit and its peripheral space from each other, and are provided so as to electromagnetically-spatially separate the space on the high-frequency circuit into a plurality of spaces.SELECTED DRAWING: Figure 8