SEMICONDUCTOR MEMORY DEVICE

摘要

PURPOSE:To provide a semiconductor memory device which enables forward mounting and reverse mounting of chips without alteration or addition of the manufacturing process while increasing integration scale. CONSTITUTION:At least data input/output pads are arranged parallely in two arrays in axial symmetry at the center of a semiconductor chip and connected by leads of LOC structure mounted with insulation on the pad arrays and the chip and by wire bonding. This can short a pad array and therefore reduce the size of a chip for this shortening, and the same wire bonding process as for forward mounting can provide a reverse mounting RAM.