发明名称 |
CARRIER FOR TEMPORARY BONDED WAFERS |
摘要 |
A carrier is disclosed onto which a wafer can be temporarily bonded. The carrier comprises a plate shaped laminate. The plate shaped laminate comprises a first layer. The first layer comprises a foil, a sheet or a plate. The plate shaped laminate comprises a second layer comprising a porous metal medium with three- dimensional open pores. The porous metal medium comprises metal fibers. The first layer is permanently bonded to the porous metal medium thereby closing the pores of the porous metal medium at the side where the first layer is located. The porous metal medium comprises a first porous layer and a second porous layer. The first porous layer is provided between the first layer and the second porous layer. The porosity of the first porous layer is higher than the porosity of the second porous layer. |
申请公布号 |
WO2016142238(A1) |
申请公布日期 |
2016.09.15 |
申请号 |
WO2016EP54434 |
申请日期 |
2016.03.02 |
申请人 |
NV BEKAERT SA |
发明人 |
GOOSSENS, Davy;DE BAERDEMAEKER, Jérémie |
分类号 |
H01L21/683;B24B37/27 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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