发明名称 |
MULTILAYER LTCC TUB ARCHITECTURE FOR HERMETICALLY SEALING SEMICONDUCTOR DIE, EXTERNAL ELECTRICAL ACCESS FOR WHICH IS PROVIDED BY WAY OF SIDEWALL RECESSES |
摘要 |
A packaging assembly for a semiconductor circuit chip is formed of a hermetically sealable, "tub"-like structure (10). The tub-like structure is comprised of a laminated stack of thin layers (11) of low temperature co-fired ceramic (LTCC) material. The laminated stack of LTCC layers contains an internally distributed network of interconnect links through which a semiconductor die (18), that has been mounted at a floor portion of the tub, may be elecrically connected to a plurality of conductive recesses or pockets located at top (81) and bottom (87) sidewall edge portions of the tub, thereby allowing multiple tubs to be joined together as a hermetically sealed assembly and electrically interconnected at the conductive pockets of adjacent tubs. |
申请公布号 |
WO9500972(A1) |
申请公布日期 |
1995.01.05 |
申请号 |
WO1994US07604 |
申请日期 |
1994.06.28 |
申请人 |
HARRIS CORPORATION |
发明人 |
NEWTON, CHARLES, M.;PALMER, EDWARD, G.;SANCHEZ, ALBERT;MYERS, CHRISTOPHER, A. |
分类号 |
H01L21/48;H01L21/60;H01L23/13;H01L23/498;H01L25/10 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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