| 摘要 |
<p>PURPOSE: To provide a device which automatically bonds an integrated circuit in a recessed part formed in a plastic card normally called 'chip card', using a milling process. CONSTITUTION: The device for manufacturing a card having a semiconductor chip comprises a milling part 1 for milling a recessed part in many plastic cards, an inlaying part 3 for bonding a semiconductor chip of an integrated circuit in the recessed part and a device 2 for conveying the cards to be milled from the milling part 1 to the inlaying part 3 while controlling the speed differences between the milling part 1 and the inlaying part 3 and leveling off the stacking differences of the cards. Thus, it is possible to offer many chip cards at a low price.</p> |
