| 摘要 |
PURPOSE:To obtain a manufacture of a semiconductor element which reduces sticking matters at the time of machining as much as possible and prepares the semiconductor element of excellent characteristics and a forming method of a protective film which can form the protective film on an end face simply and with an excellent yield and can form it without depending on the shape of the end face. CONSTITUTION:A laser end face to be a resonator of a laser, a coupler part 6 for branching-coupling of a light wave, etc., are prepared in a semiconductor element by a focused ion beam etching method. On the occasion, focused ion beam etching is executed while at least the laser end face, the coupler part 6, etc., of the semiconductor element are cooled down. |
