| 摘要 |
1302827 Semiconductor devices RCA CORPORATION 19 April 1971 [11 June 1970] 23311/71 Heading H1K A semiconductor assembly comprises a housing 12 of electrically insulating and thermally conductive material with a passage 14 extending therethrough, a semiconductor element 30, e.g. a transistor being located near one end of the passage, regions of the element 30 being connected to strip line conductors 48a, 48b, and a mounting plate 52. The housing may be of beryllium oxide or aluminium oxide, and have metal films 20, 24 e.g. of silver, gold, or copper thereon, the element 30 being mounted on a block 28, e.g. of silver, molybdenum or copper attached to the film 24 which is connected to the conductor 48 b which seals one end of the passage 14. Other regions of the element, e.g. base and emitter, are connected via thin wires to a metal film 42 supported on an insulating ring 36, or the film 20, respectively. The conductor 48a which may be an alloy of iron, copper or nickel, contacts the films 42 and seals the other end of the passage 14. The film 20 may be brazed or soldered to the plate 52. The assembly is said to be useful for high frequency applications and reduces inductance and capacitance of the leads. |
