SEMICONDUCTOR OPTOELECTRONIC DEVICE PACKAGE

摘要

A new package for semiconductor optoelectronic devices is disclosed which comprises a novel geometrical configuration. The package includes a metal stud which has a pedestal and a screw portion. An elongated insulated tab is mounted on top of the stud. The tab has an opening at the mounted end and an electrically conducting path along the bottom, which path is perpendicular to and in contact with the stud. A block of high conductivity material is mounted through the opening in the tab and attached to the top of the stud to provide electrical and thermal conductivity therebetween. Mounted on the block is an optoelectronic semiconductor device. The patent further describes techniques for packaging the semiconductor optoelectronic device within the apparatus. Techniques for bonding devices into the package are easily automated and the disclosed apparatus permits the use of the device in a variety of orientations.