发明名称 |
Polyimide/glass-epoxy/glass hybrid printed circuit board |
摘要 |
A method of fabricating a "hybrid" multilayer printed circuit board combining two dissimilar plastic layers of polyimide resin/glass and of epoxy resin/glass laminates. The finished hybrid multilayer printed circuit board is for, e.g., the support of and electrical interconnection to a plurality of magnetizable memory cores. The method includes sandwiching a plurality of epoxy-glass printed circuit boards having the desired copper patterns on both sides between two polyimide-glass printed circuit boards, each having the desired copper pattern on only one side. All the printed circuit boards are laminated with epoxy-glass prepreg to form a single hybrid multilayer printed circuit board consisting of the sandwiched epoxy-glass printed circuit boards and the sandwiching polyimide-glass printed circuit boards. Interconnections between patterned layers are formed by copper-plated through-holes.
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申请公布号 |
US4464704(A) |
申请公布日期 |
1984.08.07 |
申请号 |
US19830468109 |
申请日期 |
1983.02.22 |
申请人 |
SPERRY CORPORATION |
发明人 |
HUIE, JAKEN Y.;JACOBUS, DAN |
分类号 |
H05K3/42;H05K3/46;(IPC1-7):H05K1/03 |
主分类号 |
H05K3/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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