| 摘要 |
PURPOSE:To enhance a sealed body in reliability by a method wherein an IC chip, wires, an island, and inner leads connected together by bonding are covered with insulating film and then sealed with resin. CONSTITUTION:An IC chip 6 is bonded to an island 2 of a lead frame and connected to an inner lead 4 by a wire 8. The surfaces of the island 2, the inner lead 4, the IC chip 6, and the wire 8 are covered with an insulating film 20 through a spray method, and the coated semiconductor device is sealed with molding resin 10 through a transfer molding method. The insulating film 20 enhances the molding resin 10 not only in reliability by absorbing a stress but also in moisture resistance reliability. Furthermore, molding resin can be prevented from separating from a lead frame due to a thermal expansion difference between them, whereby the semiconductor device can be enhanced in reliability. As a bonding wire is also coated with an insulating film, it can be prevented from being short-circuited when molding, and semiconductor devices of this constitution are lessened in fraction defective and enhanced in yield in a manufacturing process. |
