发明名称 Process for metallizing a solid body
摘要 PCT No. PCT/EP84/00223 Sec. 371 Date Feb. 11, 1985 Sec. 102(e) Date Feb. 11, 1985 PCT Filed Jul. 18, 1984 PCT Pub. No. WO85/00623 PCT Pub. Date Feb. 14, 1985.To metallize a preferably glass-like body with good adhesion of the metal, the glass-like body is coated with a thin layer of an indium-tin alloy, whereupon a catalytic germination layer is produced for currentless chemical metal precipitation by reducing a catalyst metal compound to the catalyst metal directly by the indium-tin layer or after the indium-tin layer has been reacted by salt formation or hydrolysis. After currentless chemical metallization, reinforcement may continue by electroplating with conventional metals.
申请公布号 US4692356(A) 申请公布日期 1987.09.08
申请号 US19850703679 申请日期 1985.02.11
申请人 LICENTIA PATENT-VERWALTUNGS-GMBH 发明人 OSTWALD, ROBERT;VOIT, GABRIELE
分类号 C03C17/40;C23C18/18;(IPC1-7):B05D3/10 主分类号 C03C17/40
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