| 摘要 |
PURPOSE:To prevent a flux from adhering to connectors on the surface by a method wherein a plurality of printed-wiring boards are aligned tight, they pass over a nozzle, a low corrosive flux is jetted from the nozzle and their back is coated. CONSTITUTION:A plurality of printed-wiring boards 1a, 1b with components mounted on are sent automatically to a flux means without leaving any space between them. Then, a low corrosive flux 3 is jetted from the back side of the printed-wiring boards 1a, 1b, and they are coated with the flux 3. Lastly, a solder is applied to the printed-wiring boards 1a, 1b. It is possible to prevent the flux from adhering to connectors on the surface. Thereby, it is possible to eliminate a cleaning process after a soldering operation without a special process such as a taping or the like. |
