| 摘要 |
PURPOSE:To use a raw material resin having low viscosity and to make it possible to form a thin uniform coating resin layer on a semiconductor pellet, by providing protruding part on the peripheral part of the electrode-forming main surface of the semiconductor pellet. CONSTITUTION:A dam 9 is provided on the peripheral part of the electrode- forming main surface of a semiconductor pellet 3. After electrical connection, a raw material resin for forming a resin layer 8 on said semiconductor pellet 3 is dropped on said main surface. At this time, the outflow of the raw material resin can be prevented with the dam. Therefore, the raw material resin having low viscosity can be used. As a result, the raw material resin can be applied thinly and uniformly. Therefore, the resin layer 8, which is formed by baking, can be also formed thinly and uniformly.
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