| 摘要 |
PURPOSE:To obtain a resin composition for sealing electronic and electric parts, etc., having excellent moisture resistance after immersion in soldering bath and soldering heat resistance, comprising an epoxy resin, a novolak phenolic resin, a ketone resin and an inorganic filler as essential components. CONSTITUTION:A composition containing (A) an epoxy resin [e.g. resin shown by formula I (R<1> is H, halogen or alkyl; R<2> is H or alkyl; n>=1), etc.]. (B) a novolak phenolic resin (e.g. reaction resin of phenol and formaldehyde, etc.). (C) a ketone resin (e.g. resin shown by formula II, etc.) and (D) an inorganic filler (e.g. silica powder, alumina, etc.) as essential components in amounts to give 0.1-10wt.% component C and 25-90wt.% component D based on sum of the resin composition. The equivalent ratio of epoxy group in the component A to phenolic hydroxyl group in the component B of the component A/B is preferably 0.1-10.
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