发明名称 Method of shaping the edges of slices of semiconductor material and corresponding apparatus.
摘要 <p>The invention concerns a method in which the edge of the slices (L) is made to slide in contact with the surfaces of a pad (B) soaked in acid substances and in which, during the process, the areas of the edge of the slices that have been in contact with the pad are periodically washed with a special liquid, contained in the tank (M).</p>
申请公布号 EP0297648(A2) 申请公布日期 1989.01.04
申请号 EP19880201242 申请日期 1988.06.20
申请人 SGS-THOMSON MICROELECTRONICS S.P.A. 发明人 BERETTA, GIORGIO;INSERRA, ANTONINO
分类号 H01L21/205;H01L21/00;H01L21/304;H01L21/306 主分类号 H01L21/205
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