Film carrier structure capable of simplifying test

摘要

A plurality of semiconductor integrated circuit devices are mounted on a film carrier. First electrical connecting sections and first electrical wiring sections for electrically connecting the first electrical connecting sections to the semiconductor integrated circuit devices are provided on the film carrier. Second and third electrical connecting sections and second electrical wiring sections are provided on a film-like probe for electrical characteristic test. The second electrical connecting sections are provided in position corresponding to the first electrical connecting sections of the film carrier. The third electrical connecting sections are used to supply electrical signals to the exterior or derive an electrical signal to the exterior and check the electrical signal. The second electrical wiring sections connects the second and third electrical connecting sections to each other. The film-like probe and the film carrier are superposed on each other so as to set the second electrical connecting sections of the filmlike probe into contact with the first electrical connecting sections of the film carrier.