| 摘要 |
PURPOSE:To lessen the heat dissipating path of a multichip module in heat resistance by a method wherein the upside of a resin package is polished to make all thermally conductive block exposed in the same plane, and a heat dissipating fin is bonded to the exposed plane of the package. CONSTITUTION:A thin film multilayered circuit board 31 is composed of a board 40 and a thin film multilayered wiring layer 41 formed on the upside of the board 40. Semiconductor chips 32-1 to 32-4 are mounted on the upside of the circuit board 31 or the thin film multilayered wiring layer 41. Thermally conductive blocks 33-1 to 33-4 are bonded to the upside of the semiconductor chips 32-1 to 32-4 with silver paste 42 of resin high in thermal conductivity. Leads 37 are extended outwards. The circuit board 31, semiconductor chips, the thermally conductive blocks are sealed off in a resin package 34, and furthermore the leads 37 are partially sealed up with resin 34. The plane 43 of the resin package 34 is polished, and a heat dissipating fin 36 is bonded to the polished plane 43 with silicone resin adhesive agent 46. |
