发明名称 FIXING STRUCTURE AND METHOD FOR FIELD EMISSION COLD-CATHODE ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide a fixing structure superior in mounting accuracy by fixing the circumference of a field emission cold-cathode element by inorganic adhesive having a prescribed hardening temperature. SOLUTION: A field emission cold-cathode element 2 is mounted on a conductive substrate 1 using a mount material 3. Secondly, the circumference of the field emission cold-cathode element 2 is fixed by the inorganic adhesive 4 which is hardened at the temperature lower than the hardening temperature of the mount material 3 used for the mount. The inorganic adhesive 4 which is hardened at the temperature lower than the hardening temperature of the mount material 3 used for mounting the field emission cold-cathode element 2 on the conductive substrate 1 is used for a position fixation so that the deterioration in the mounting accuracy can be prevented in fixing the position. A prescribed position accuracy can be held in a high temperature process in glass sealed in cathode-ray tube as an electronic gun.
申请公布号 JPH09213200(A) 申请公布日期 1997.08.15
申请号 JP19960014059 申请日期 1996.01.30
申请人 NEC CORP 发明人 KONDO YUJI;YANO AKIHIRO
分类号 H01J1/304;H01J9/02;H01J9/18;H01J29/04;H01J29/48;H01L21/58;H01L21/60 主分类号 H01J1/304
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