| 摘要 |
An opening is formed in a region of a circuit board opposite a vibration region E of a piezoelectric element. The piezoelectric element is mounted to the circuit board, and electrical connections extend between and support the piezoelectric element from the circuit board by a solder. The soldered connection portions are surrounded by a bonding agent. An opening in the circuit board prevents any excess bonding agent from invading the vibration region E of the piezoelectric element, and the bonding agent assists in dispersing stresses exerted on the circuit board thereby minimizing the stresses transferred to the piezoelectric element.
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