| 摘要 |
PROBLEM TO BE SOLVED: To provide a wire bonding method and apparatus for relaxing connection conditions without the application of ultrasonic vibration, and also to provide a method for forming a wire bump. SOLUTION: A wire bonding apparatus 10 has its constituent parts which are arranged along a conveyor device 14. The device 14 is provided at its start end with a stocker 16 and at its exit end with a magazine rack 18. A fluorinating section 20 for performing fluorinating treatment over a substrate 13, a bonding section 26 for connecting an electrode 22 and a land 24 by a metal wire 48, and a mold sealing section 28 for sealing a bare chip 12 with mold are provided between the stocker 16 and rack 18. Since the electrode 22 and land 24 are fluorinated on their surfaces, when a metal wire 48 is brought into contact with the electrode 22 or the land 24, both are connected. For this reason, it becomes unnecessary to apply ultrasonic vibration, and the heating temperature can be lowered. |
