发明名称 PLASMA TREATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a plasma treating apparatus for preventing abnormal discharges in an exhaust space. SOLUTION: A current conductive member 136 constituted of a baffle plate 138 electrically connected with the inner sidewall of a treatment chamber 102 of an etching device 100, and a cylindrical member 140 electrically connecting the baffle 138 with the floor part of the treatment chamber 102 is arranged in the treatment chamber 102, and the treatment chamber 102 is divided into a discharge space 142 and an exhaust space 144. When a power which is 27.121 MHz is impressed on a lower electrode 106, a glow discharge is generated between the lower electrode 106 and the upper electrode 124 in the discharge space 142, and plasma is generated. Ground return currents running through an inner wall A of the treatment chamber 102 in the discharge space 142 are allowed to run on a discharge space 142 side surface B of the baffle plate 138 and an inner wall surface C of the cylindrical member 40 by a conductor skin effect, and reach the floor surface D of the treatment chamber 102, and return to a metcher 114 without penetrating into the exhaust space 144.
申请公布号 JP2000286242(A) 申请公布日期 2000.10.13
申请号 JP19990091566 申请日期 1999.03.31
申请人 TOKYO ELECTRON LTD 发明人 SUEMASA TOMOKI;INASAWA KOICHIRO;ONO TAKESHI
分类号 H01L21/302;B01J19/08;H01J37/32;H01L21/3065;H05H1/46 主分类号 H01L21/302
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