SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

摘要

PROBLEM TO BE SOLVED: To enable an LSI package to be improved in reflow crack resistance. SOLUTION: A semiconductor integrated circuit device is equipped with a chip mount 3 where a semiconductor chip 2 is mounted, the semiconductor chip 2 which is mounted on the mount 3 and possessed of a plurality of bonding pads on its main surface, and leads composed of inner leads are arranged so as to surround the chip 2 and outer leads which are connected to the inner leads extending outward from the inner leads. At this point, the chip mount 3 is formed of suspended leads 4 which cross each other.