ELECTROPLATING BATH COMPOSITION AND METHOD OF USING
摘要
The present invention relates to a copper electroplating bath composition and method of using it for microelectronic device fabrication. In particular, the present invention relates to cooper electroplating in the fabrication of interconnect structures in semiconductor devices. By use of the inventive copper eletroplating bath composition, the incidence of voids in the interconnect structures is reduced.
申请公布号
WO0183854(A2)
申请公布日期
2001.11.08
申请号
WO2001US12348
申请日期
2001.04.10
申请人
INTEL CORPORATION;HONG, KIMIN;BAXTER, NATHAN, E.;DUBIN, VALERY, M.