| 摘要 |
PROBLEM TO BE SOLVED: To suppress rise of solder at the joining part of a wiring pattern on a substrate and the lead wire of a coil for transmission/reception. SOLUTION: Near the end face of the substrate 4 loaded on this semiconductor device 1, a through-hole is provided so as to form an opening on the end face and to pass through in the thickness direction of the substrate. A terminal 9 is provided along the inner surface of the through-hole and the lead wire 8 of the coil 3 for the transmission/reception is inserted inside the terminal 9 and connected. |
