发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device which suppresses a decrease in the inductance of a coil by reducing an eddy current generated by a head. SOLUTION: This semiconductor device has a semiconductor chip and the inductance element in planar structure, formed on the top surface of the semiconductor chip, and the semiconductor chip is fixed on a conductor frame and packaged; and the conductor frame has its part made of a magnetic body opposite the reverse surface of the semiconductor chip.
申请公布号 JP2002016209(A) 申请公布日期 2002.01.18
申请号 JP20000194570 申请日期 2000.06.28
申请人 TOSHIBA CORP 发明人 INOUE TETSUO;ITO TAKAO
分类号 H01L25/00;H01L21/02;H01L21/52;H01L23/64;H01L27/08 主分类号 H01L25/00
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