| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board for a semiconductor package, together with its manufacturing method, for highly-integrated design and high reliability. SOLUTION: There are provided a resin layer 2 comprising almost flat first and second surfaces, a conductive circuit pattern 4 comprising a bond finger 4a and a ball land 4b on any one surface of the first and second surfaces 2a and 2b of the resin layer, a solder mask 8 coated on the entire conductive circuit pattern except for the bond finger and the ball land as well as on such a surface of the resin layer as no conductive circuit pattern is formed, and a plated layer 6 where nickel and gold are sequentially plated only on a horizontal surface and any one surface among the first and second surfaces of resin layer, on the surfaces of bond finger and ball land exposed outside by the solder mask. |
