| 摘要 |
PROBLEM TO BE SOLVED: To increase bonding reliability of a die pad down binding by preventing delamination between a die pad and a molding resin, and bleeding. SOLUTION: A die pad 2 formed in a QFN semiconductor device 1 has a rectangle pad portion 2a where a semiconductor chip is mounted and down bonding portions 2b, 2c formed having four sides of the die pad 2a extending outside. Folded portions K are formed between the die pad portion 2a and the down bonding portions 2b, 2c, and the down bonding portions 2b, 2c are placed upward relative to the die pad portion 2a. The down bonding portions 2b, 2c are connected to arbitrary electrodes for a reference voltage VSS in the semiconductor chip 5 via bonding wires 7a to increase electrical performance, so called down bond is performed. |
